Description:
Used for semiconductor triode heat dissipation
Add a fan to the cross section to enhance heat dissipation.
LED low power heat sink, semiconductor IC chip triode heat sink.
For motherboard thermal conduction
Specification:
Material : Aluminium
Size : 80x40x40mm / 3" x 3"x 1.6"(L*W*H)
Package Includes:
1x Heat Sink